New Publication

Our submission, A Design Flow Framework for Fully-Connected Neural Networks Rapid Prototyping, is accepted to International Conference on Omni-Layer Intelligent Systems (COINS’19).

Recent News

Our submission “Online Energy Management Framework for Smart Buildings with Low-Complexity Estimators”, a collaboration with IMEC v.z.w. (Belgium) and Osaka University (Japan) is accepted in IEEE Embedded Systems Letters.

Our submission “Hardware-Aware Automated Neural Minimization for Printed Multilayer Perceptrons”, a collaboration with Karlsruhe Institute of Technology (KIT) and University of Patras (Greece) is accepted in Design, Automation and Test in Europe (DATE’23) conference.

Our submission “Dynamic Heap Management in High-Level Synthesis for Many-Accelerator Architectures”, a collaboration with IBM Zurich Research Laboratory is accepted in International Conference on Field Programmable Logic & Applications (FPL) 2022.

Our submission “AdaPT: Fast Emulation of Approximate DNN Accelerators in PyTorch“, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT), is accepted in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2022

Our submission, Variability-Aware Approximate Circuit Synthesis via Genetic Optimization, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT), is accepted to IEEE Transactions on Circuits and Systems I: Regular Papers.

Our submission, “Wide-range light harvesting module for autonomous sensor nodes” is accepted to IEEE Access, 2022, doi: 10.1109/ACCESS.2022.3161486.

Our submission, “Design of a 10-Bit, 2GS/S Current-Steering Digital-to-Analog Converter with On-Line Current Calibration” is accepted to IEEE International Symposium on Circuits & Systems (ISCAS), 2022.

Our submission, Automated Design Approximation to Overcome Circuit Aging, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT), is accepted to IEEE Transactions on Circuits and Systems I: Regular Papers.

Our submission, Thermal Comfort Aware Online Energy Management Framework for a Smart Residential Building, a collaboration with Osaka University (Japan), IMEC (Belgium), and National Technical University of Athens (Greece), is accepted to Design, Automation and Testing in Europe (DATE’21) conference.

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H2020 SERRANO project was accepted for funding.

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SMARTBEEING: Bee population health, wellbeing and yield improvement through novel monitoring technologies project was accepted for funding.

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ICE: “Innovative Cultural Experience” project was accepted for funding.