New Publication

Our submission “Hardware-Aware DNN Compression via Diverse Pruning and Mixed-Precision Quantization”, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT) and Southern Illinois University is accepted in IEEE Transactions on Emerging Topics in Computing, 2023.

Recent News

Our submission “Online Energy Management Framework for Smart Buildings with Low-Complexity Estimators”, a collaboration with IMEC v.z.w. (Belgium) and Osaka University (Japan) is accepted in IEEE Embedded Systems Letters.

Our submission “Hardware-Aware Automated Neural Minimization for Printed Multilayer Perceptrons”, a collaboration with Karlsruhe Institute of Technology (KIT) and University of Patras (Greece) is accepted in Design, Automation and Test in Europe (DATE’23) conference.

Our submission “Dynamic Heap Management in High-Level Synthesis for Many-Accelerator Architectures”, a collaboration with IBM Zurich Research Laboratory is accepted in International Conference on Field Programmable Logic & Applications (FPL) 2022.

Our submission “AdaPT: Fast Emulation of Approximate DNN Accelerators in PyTorch“, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT), is accepted in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2022

Our submission, Variability-Aware Approximate Circuit Synthesis via Genetic Optimization, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT), is accepted to IEEE Transactions on Circuits and Systems I: Regular Papers.

Our submission, “Wide-range light harvesting module for autonomous sensor nodes” is accepted to IEEE Access, 2022, doi: 10.1109/ACCESS.2022.3161486.

Our submission, “Design of a 10-Bit, 2GS/S Current-Steering Digital-to-Analog Converter with On-Line Current Calibration” is accepted to IEEE International Symposium on Circuits & Systems (ISCAS), 2022.

Our submission, Automated Design Approximation to Overcome Circuit Aging, a collaboration with Chair for Embedded Systems (CES), at the Karlsruhe Institute of Technology (KIT), is accepted to IEEE Transactions on Circuits and Systems I: Regular Papers.

Our submission, Thermal Comfort Aware Online Energy Management Framework for a Smart Residential Building, a collaboration with Osaka University (Japan), IMEC (Belgium), and National Technical University of Athens (Greece), is accepted to Design, Automation and Testing in Europe (DATE’21) conference.

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H2020 SERRANO project was accepted for funding.

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SMARTBEEING: Bee population health, wellbeing and yield improvement through novel monitoring technologies project was accepted for funding.

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ICE: “Innovative Cultural Experience” project was accepted for funding.